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Title:
POLYPARAXYLYLENE FILM, PRODUCTION METHOD THEREFOR AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2003/011952
Kind Code:
A1
Abstract:
A low−permittivity and high−heat−resistance organic polymer film applicable to the insulation layer of a semiconductor device, a production method therefor, and a semiconductor device using it. A polyparaxylylene film including a porous structure, obtained by the step of sublimating the cyclic dimer of paraxylylene or its derivative, the step of pyrolyzing the obtained sublimate at 800−950°C, and the step of polymerizing the obtained pyrolysate&semi a production method therefor&semi and a semiconductor device.

Inventors:
TAKAHASHI AKIO (JP)
SATSU YUICHI (JP)
NAKAI HARUKAZU (JP)
KARDASH IGOR YEFIMOVICH (RU)
PEBALK ANDREI VLADIMIROVICH (RU)
CHVALUN SERGEI NICOLAEVICH (RU)
MAILYAN KAREN ANDRANIKOVICH (RU)
Application Number:
PCT/JP2002/007389
Publication Date:
February 13, 2003
Filing Date:
July 22, 2002
Export Citation:
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Assignee:
HITACHI LTD (JP)
KARPOV PHYS CHEM INST (RU)
TAKAHASHI AKIO (JP)
SATSU YUICHI (JP)
NAKAI HARUKAZU (JP)
KARDASH IGOR YEFIMOVICH (RU)
PEBALK ANDREI VLADIMIROVICH (RU)
CHVALUN SERGEI NICOLAEVICH (RU)
MAILYAN KAREN ANDRANIKOVICH (RU)
International Classes:
C08G61/02; C08J5/18; C08L65/04; H01L21/312; H01L21/76; H01L21/768; H01L49/02; H05K1/00; (IPC1-7): C08J5/18; C08G61/02; H01L21/768; H01L21/312; H05K3/46
Foreign References:
US5804259A1998-09-08
JP2000183056A2000-06-30
JP2000216152A2000-08-04
Attorney, Agent or Firm:
Takada, Yukihiko (Saiwai-cho 2-chome Hitachi-shi, Ibaraki, JP)
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