Title:
POLYPHENYL ETHER RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2017/067139
Kind Code:
A1
Abstract:
Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl resin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative ageing resistance.
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Inventors:
CHEN GUANGBING (CN)
ZENG XIANPING (CN)
ZENG XIANPING (CN)
Application Number:
PCT/CN2016/078808
Publication Date:
April 27, 2017
Filing Date:
April 08, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L71/12; B32B27/00; C08J5/24; C08L9/06
Foreign References:
| US20040001961A1 | 2004-01-01 | |||
| CN102807658A | 2012-12-05 | |||
| JP2005015613A | 2005-01-20 | |||
| US20110294966A1 | 2011-12-01 |
Other References:
See also references of EP 3366725A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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