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Patent Searching and Data


Title:
POLYPHENYL ETHER RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2017/067140
Kind Code:
A1
Abstract:
Provided are a thermosetting polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises: (1) a pentafunctional or higher multifunctional vinylbenzyl ether-modified thermosetting polyphenyl ether resin; and (2) a vinyl resin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the pentafunctional or higher multifunctional vinylbenzyl ether-modified thermosetting polyphenyl ether resin. The vinylbenzyl ether-modified thermosetting polyphenyl ether resin, due to containing a pentafunctional or higher multifunctional styrene active group, can cross-link more vinyl resin cross-linking agents. The prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, so that the high-speed electronic circuit substrate has a better thermo-oxidative ageing resistance; furthermore, the stability of the dielectric constant and dielectric loss of the substrate is good during long-term use.

Inventors:
CHEN GUANGBING (CN)
ZENG XIANPING (CN)
Application Number:
PCT/CN2016/078809
Publication Date:
April 27, 2017
Filing Date:
April 08, 2016
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L71/12; B32B27/04; C08G65/48; C08L9/06; C08L71/00; H05K1/02
Foreign References:
US20040001961A12004-01-01
CN102807658A2012-12-05
CN1664000A2005-09-07
CN102066491A2011-05-18
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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