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Patent Searching and Data


Title:
POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/106879
Kind Code:
A1
Abstract:
A polyphenylene ether resin composition which is characterized by containing (A) a polyphenylene ether, (B) a styrene-based thermoplastic elastomer, (C) a flame retardant and (D) a kaolin clay, and which is also characterized in that: relative to a total of 100% by mass of the components (A), (B), (C) and (D), the content of the component (A) is from 25% by mass to 84% by mass, the content of the component (B) is from 1% by mass to 20% by mass, the content of the component (C) is from 4% by mass to 25% by mass, and the content of the component (D) is from 11% by mass to 30% by mass; and the component (C) contains from 0% by mass to 97% by mass of (C-1) an organic phosphorus flame retardant that has a 10% mass loss temperature within the range of from 380°C to 430°C as measured by the measurement method described below and from 100% by mass to 3% by mass of (C-2) an organic phosphorus flame retardant that has a 10% mass loss temperature within the range of from 330°C to 360°C as measured by the measurement method described below in 100% by mass of the component (C). [Method for measuring the 10% mass loss temperatures of the component (C-1) and the component (C-2)] About 10 mg of each of the component (C-1) and the component (C-2) is weighted, and heated from 30°C to 800°C at a heating rate of 10°C/min in a nitrogen atmosphere by means of a TGA measurement device, thereby obtaining a heating loss curve from which the 10% mass loss temperature is calculated.

Inventors:
YAMAGUCHI TORU (JP)
Application Number:
PCT/JP2020/043688
Publication Date:
June 03, 2021
Filing Date:
November 24, 2020
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08K5/521; C08K3/00; C08K3/34; C08K9/06; C08L53/02; C08L71/12
Foreign References:
JPS57501966A1982-11-04
JPS61130368A1986-06-18
JP2011252114A2011-12-15
JP2005023260A2005-01-27
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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