Title:
POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2024/048546
Kind Code:
A1
Abstract:
The polyphenylene ether resin composition that is one aspect of the present invention contains, per 100 mass parts of a polyphenylene ether-containing resin (A) that contains at least more than 80 mass% of a polyphenylene ether resin (a), 5 to 25 mass parts of an inorganic filler (c), 15 to 27 mass parts of a phosphorus flame retardant (d), 0.3 to 7 mass parts of a polyolefin resin (e) having a skeleton derived from ethylene, 3 to 20 mass parts of tracking resistance improving agent (f), and 0.5 to 3 mass parts of a phosphorus stabilizer (g). The mass ratio of the polyolefin resin (e) to the phosphorus component in the polyphenylene ether resin composition is 0.2 to 2.65. The melt flow rate of the polyolefin resin (e) measured in accordance with JIS K7210 under measurement conditions of a temperature of 190°C and a load of 2.16 kg is 0.5 to 100 g/10 minutes.
Inventors:
TAKANO YOICHI (JP)
Application Number:
PCT/JP2023/031095
Publication Date:
March 07, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
GLOBAL POLYACETAL CO LTD (JP)
International Classes:
C08L71/12; C08K3/013; C08K3/26; C08K5/521; C08K5/524; C08L23/04
Domestic Patent References:
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Foreign References:
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Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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