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Title:
POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/130735
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a polyphenylene ether resin composition which contains (A) a modified polyphenylene ether compound that is terminally modified by a substituent which has a carbon-carbon unsaturated double bond and (B) a crosslinking-type curing agent that has two or more carbon-carbon unsaturated double bonds in each molecule, and which is characterized in that the modified polyphenylene ether compound (A) contains (A-1) a modified polyphenylene ether compound that has a specific structure and (A-2) a modified polyphenylene ether compound that has a specific structure.

Inventors:
UMEHARA, Hiroaki
SUZUKI, Fumito
YASUMOTO, Jun
INOUE, Hiroharu
Application Number:
JP2018/038418
Publication Date:
July 04, 2019
Filing Date:
October 16, 2018
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
C08F299/02; B32B5/00; B32B15/08; B32B27/00; B32B27/26; C08G65/48; C08J5/24; H05K1/03
Domestic Patent References:
WO2017067123A12017-04-27
Foreign References:
CN107163244A2017-09-15
JP2017128718A2017-07-27
US20170174835A12017-06-22
JP2016531959A2016-10-13
JP2005292413A2005-10-20
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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