Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYPROPYLENE-BASED RESIN COMPOSITION, AND FIBER AND NONWOVEN FABRIC USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/022004
Kind Code:
A1
Abstract:
Provided are: [1] a polypropylene-based resin composition that satisfies conditions (1) and (2) in a differential molecular weight distribution curve which is obtained from measurement by means of gel permeation chromatography using polystyrene as a conversion standard, and in which the horizontal axis represents the logarithmic value log(M) of the molecular weight M and the vertical axis represents the value dw/dlog(M) obtained by differentiating the concentration fraction w by the logarithmic value log(M) of the molecular weight (wherein, (1) in the differential molecular weight distribution curve, the value obtained by integrating the values of dw/dlog(M) in the range of 5.5≤log(M) is not more than 25% of the value obtained by integrating the values of dw/dlog(M) across the entire range of log(M), and, (2) in the differential molecular weight distribution curve, the value obtained by integrating the values of dw/dlog(M) in the range of 4.5≤log(M) exceeds 10% of the value obtained by integrating the values of dw/dlog(M) across the entire range of log(M)); [2] a polypropylene-based resin composition having a melt flow rate (MFR) of 10-500 g/10 min, while the half crystallization period exceeds 0.05 seconds; and [3] a polypropylene-based resin composition that comprises 40-99 mass% of a polypropylene-based resin (A) having a melting point (Tm-D) of more than 120°C, 0.5-59.5 mass% of a polypropylene-based resin (B-1) having a melting endotherm (ΔH-D) of 0-80 J/g, and 0.5-59.5 mass% of wax (B-2).

Inventors:
YABE MARI (JP)
SUGIUCHI TAKUMI (JP)
MINAMI YUTAKA (JP)
TAKEBE TOMOAKI (JP)
Application Number:
JP2018/027498
Publication Date:
January 31, 2019
Filing Date:
July 23, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C08L23/10; C08L23/02; D01F1/10; D01F6/06; D01F8/06; D04H3/007; D04H3/14; D04H3/147
Domestic Patent References:
WO2011030893A12011-03-17
WO2016002950A12016-01-07
WO2012105567A12012-08-09
WO2011030893A12011-03-17
Foreign References:
JP2016040428A2016-03-24
JP2014177729A2014-09-25
US3671379A1972-06-20
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (JP)
Download PDF: