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Patent Searching and Data


Title:
POLYPROPYLENE FILM AND MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2020/090628
Kind Code:
A1
Abstract:
The present invention provides a polypropylene film which has improved surface flexibility, while exhibiting excellent surface smoothness, transparency and mold releasability, and which is suitable for use as a mold release film. A polypropylene film according to the present invention has an elastic modulus of 2.5 GPa or less as determined by measuring at least one surface thereof by a nanoindentation method; and the crystallization peak temperature (Tc) of this polypropylene film is 110°C or more as measured by a differential scanning calorimeter DSC, while being heated at a heating rate of 20°C/min from 25°C to 250°C and subsequently cooled at a cooling rate of 20°C/min from 250°C to 25°C.

Inventors:
IMANISHI YASUYUKI (JP)
OKADA KAZUMA (JP)
OHKURA MASATOSHI (JP)
YAMANAKA KOHEI (JP)
Application Number:
PCT/JP2019/041764
Publication Date:
May 07, 2020
Filing Date:
October 24, 2019
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08J5/18; B29C55/14; B32B27/32
Domestic Patent References:
WO2017221985A12017-12-28
WO2018147335A12018-08-16
WO2019044758A12019-03-07
Foreign References:
JP2010214810A2010-09-30
JP2009542873A2009-12-03
JP2017035884A2017-02-16
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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