Title:
POLYSILICON FILAMENT BINDING DEVICE USING POLYSILICON FRAGMENTS
Document Type and Number:
WIPO Patent Application WO/2015/199498
Kind Code:
A1
Abstract:
The present invention relates to a polysilicon filament manufacturing device, and more specifically, to a polysilicon filament binding device for manufacturing a polysilicon filament having a desired length by connecting polysilicon fragments cut from damage, etc. The present invention provides a polysilicon filament binding device comprising: a body part having a barrel-shape; a guide part provided inside the body part, guiding incoming polysilicon fragments; and a main light source for heating the binding surfaces of the polysilicon fragments.
Inventors:
KANG BYUNG-CHANG (KR)
KIM CHANG-RYOL (KR)
KIM CHANG-RYOL (KR)
Application Number:
PCT/KR2015/006587
Publication Date:
December 30, 2015
Filing Date:
June 26, 2015
Export Citation:
Assignee:
OCI CO LTD (KR)
International Classes:
B23K20/06; B23K20/26; B23K101/00; B23K103/08
Foreign References:
| JPH054877A | 1993-01-14 | |||
| KR20030061747A | 2003-07-22 | |||
| KR20140071279A | 2014-06-11 | |||
| JP2002254179A | 2002-09-10 |
Other References:
See also references of EP 3162487A4
Attorney, Agent or Firm:
DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
특허법인 대아 (KR)
특허법인 대아 (KR)
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