Title:
POLYSILSESQUIOXANE RESIN COMPOSITION FOR FLEXIBLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/116171
Kind Code:
A1
Abstract:
The present invention relates to a polysilsesquioxane resin composition for a flexible substrate. More specifically, the present invention relates to a polysilsesquioxane resin composition for a flexible substrate, having excellent heat resistance and transparency, the resin composition being usable for a flexible display substrate. More specifically, a transparent thin film can be formed, excellent transmittance is exhibited in the visible range even after curing, heat resistance is excellent, and flexibility and crack resistance can be controlled. Compared to a conventional polyimide-based substrate material, the present invention has excellent insulation characteristics and passivation characteristics, which can be satisfied simultaneously, and is advantageous for productivity since release characteristics are ensured during a delamination process from a glass substrate.
Inventors:
KIM JUN YOUNG (KR)
KIM HWA YOUNG (KR)
CHOI HO SUNG (KR)
KIM HWA YOUNG (KR)
CHOI HO SUNG (KR)
Application Number:
PCT/KR2016/015491
Publication Date:
July 06, 2017
Filing Date:
December 29, 2016
Export Citation:
Assignee:
LTC CO LTD (KR)
International Classes:
C08G77/16; C08K5/00; C08K5/5415; C08L83/06; H05K1/03
Foreign References:
| KR20100131312A | 2010-12-15 | |||
| KR101520793B1 | 2015-05-18 | |||
| KR20100097558A | 2010-09-03 | |||
| KR20110016538A | 2011-02-18 | |||
| KR20130079292A | 2013-07-10 |
Attorney, Agent or Firm:
HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP (KR)
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