POLYSILSESQUIOXANE RESIN COMPOSITION AND LIGHT-SHIELDING BLACK RESIST COMPOSITION CONTAINING SAME

WIPO Patent Application WO/2017/142153

A1

The present invention relates to: a high heat resistant and low dielectric polysilsesquioxane resin composition applicable to a liquid crystal display, an OLED, a touch panel, electronic paper, a flexible display and the like; and a light-shielding black resist composition containing the same. More specifically, the present invention relates to a light-shielding black resist composition having high heat resistant and low dielectric characteristics, and comprising: 1) a polysilsesquioxane random copolymer resin composition, which contains a polar heterocyclic structure and can be curable by UV rays; 2) a carbon black dispersion dispersed in the polysilsesquioxane resin and coated therewith; and 3) a photoinitiator. Compared with conventional acrylic or cardo-based black resist, the black resist resin composition of the present invention has excellent heat resistance even in a post high-temperature process of 350°C or higher, has no optical density (O.D.) deterioration, and can satisfy low dielectric properties at the same time.

KIM JUN YOUNG (KR)
KIM HWA YOUNG (KR)
CHOI HO SUNG (KR)

PCT/KR2016/010133

August 24, 2017

September 09, 2016

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LTC CO LTD (KR)

C08G77/16; C08K3/04; C08L83/06; G02F1/1335; G03F7/075; G06F3/041; H01L21/3105; H01L51/52

KR20100131312A	2010-12-15
KR20150106386A	2015-09-21
KR20060078788A	2006-07-05
KR20130010583A	2013-01-29
KR20060020830A	2006-03-07

HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP (KR)

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