Title:
POLYSTYRENE RESIN COMPOSITION AND ORIENTED POLYSTYRENE FILM
Document Type and Number:
WIPO Patent Application WO/1996/017889
Kind Code:
A1
Abstract:
A polystyrene resin composition comprising 90-99.99 wt.% of a highly syndiotactic polystyrene (SPS) and 10-0.01 wt.% of a spherical aluminosilicate with a pH of 5 to 11; an oriented polystyrene film made therefrom; another polystyrene resin composition comprising 99.2-99.95 wt.% of SPS and 0.8-0.05 wt.% of a spherical regular-shaped elastomer with an average particle diameter of 0.1-3 'mu'm and having a melt index of 1 to 50 as measured at 300 �C under the load of 2.16 kg; and an oriented polystyrene film made therefrom. The composition is excellent in melt heat stability and reduced in the generation of white powder in the continuous film-forming step, and can provide an oriented film excellent in slipperiness, dielectric breakdown voltage (AC) and tear strength. The obtained film is useful as various film base materials.
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Inventors:
FUNAKI KEISUKE (JP)
OKADA AKIHIKO (JP)
UCHIDA TAKAAKI (JP)
OKADA AKIHIKO (JP)
UCHIDA TAKAAKI (JP)
Application Number:
PCT/JP1995/002420
Publication Date:
June 13, 1996
Filing Date:
November 28, 1995
Export Citation:
Assignee:
IDEMITSU PETROCHEMICAL CO (JP)
FUNAKI KEISUKE (JP)
OKADA AKIHIKO (JP)
UCHIDA TAKAAKI (JP)
FUNAKI KEISUKE (JP)
OKADA AKIHIKO (JP)
UCHIDA TAKAAKI (JP)
International Classes:
B29C55/00; C08J5/18; C08K3/34; C08K3/36; C08K7/18; C08L25/06; C08L33/00; (IPC1-7): C08L25/00; B29C55/02; B29C55/20; C08K3/34; C08L9/00; C08L9/10; C08L21/00; C08L21/02; C08L51/00; C08L53/00
Foreign References:
JPH0374437A | 1991-03-29 | |||
JPH03109453A | 1991-05-09 | |||
JPH06297563A | 1994-10-25 | |||
JPH06114925A | 1994-04-26 | |||
JPH03149206A | 1991-06-25 | |||
JPH01146944A | 1989-06-08 | |||
JPH01182350A | 1989-07-20 | |||
JPH04279646A | 1992-10-05 | |||
JPH05271501A | 1993-10-19 | |||
JPH01108244A | 1989-04-25 | |||
JPH01156333A | 1989-06-19 | |||
JPS63130650A | 1988-06-02 |
Other References:
See also references of EP 0747432A4
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