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Title:
POLYURETHANE, POLISHING LAYER, POLISHING PAD, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/117834
Kind Code:
A1
Abstract:
Provided are: a polyurethane for forming a polishing layer in which clogging can be suppressed, and polishing can be performed stably and with long service life with suppressed occurrence of damage; a polishing layer and polishing pad which use the polyurethane; and a polishing method.　A polyurethane having at least one structural unit derived from a compound having a carboxy group. A polishing layer and polishing pad which use the polyurethane, and a polishing method.

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Inventors:
SUNAYAMA AZUSA (JP)
TAKAOKA NOBUO (JP)
HATTORI KAZUMASA (JP)
HAYASHI KOICHI (JP)
KATO MITSURU (JP)
OKAMOTO CHIHIRO (JP)
KATO SHINYA (JP)
Application Number:
PCT/JP2020/046159
Publication Date:
June 17, 2021
Filing Date:
December 10, 2020
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08G18/34; B24B37/24; C08G18/65; H01L21/304
Foreign References:
JP2017141393A2017-08-17
JP2007287938A2007-11-01
KR20180024096A2018-03-08
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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