Title:
POLYURETHANE RESIN COMPOSITION AND ADHESIVE COMPOSITION, LAMINATE, AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/046032
Kind Code:
A1
Abstract:
The present invention provides a polyurethane resin composition having high adhesiveness to various plastic films and metals, high moist heat resistance that can even accommodate soldering after humidification, and excellent flame retardancy without using any halogen or antimony, and an adhesive composition, laminate, and printed wiring board that use the polyurethane composition. A polyurethane resin composition containing a polyurethane resin (A) that satisfies (1)-(3) and an epoxy resin (B). (1) Includes a polyester polyol containing a phosphorus compound residue represented by general formula (1) or general formula (2) as a structural component; (2) an acid value (unit: Eq/106 g) of from 50 to 1000; (3) a urethane group concentration (unit: Eq/106 g) of from 100 to 600 (R1 and R2 are each independently a hydrogen atom or hydrocarbon group, R3 and R4 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group, and l and m are integers of 0 to 4.) (R5 is a hydrogen atom or hydrocarbon group, and R6 and R7 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group.)
Inventors:
NANBARA SHINTARO (JP)
ITO TAKESHI (JP)
ITO TAKESHI (JP)
Application Number:
PCT/JP2014/074793
Publication Date:
April 02, 2015
Filing Date:
September 19, 2014
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L75/06; C08G18/46; C08G59/14; C08K3/00; C08K5/00; C08L63/00; C09J11/04; C09J11/06; C09J163/00; C09J175/06; H05K1/02; H05K1/03; H05K3/28
Domestic Patent References:
| WO2011111471A1 | 2011-09-15 |
Foreign References:
| JP2005060489A | 2005-03-10 | |||
| JP2003246831A | 2003-09-05 | |||
| JP2009132821A | 2009-06-18 | |||
| JPS63288747A | 1988-11-25 | |||
| JP2000327738A | 2000-11-28 |
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