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Patent Searching and Data


Title:
POLYVINYL ACETAL RESIN COMPOSITION, ADHESIVE SHEET, AND METHOD FOR PRODUCING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2017/061547
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polyvinyl acetal resin composition that can be molded by extrusion and that is capable of exhibiting excellent heat resistance after molding, an adhesive sheet comprising the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention is a polyvinyl acetal resin composition that contains a polyvinyl acetal, a reactive diluent, and a photopolymerization initiator. The polyvinyl acetal resin composition has a storage elastic modulus G' of 8×104 Pa or less at 200 °C prior to irradiation with light, a storage elastic modulus G' of 8×103 Pa or more at 200 °C after irradiation with light, and a higher elastic storage modulus G' at 200 °C after irradiation with light than the elastic storage modulus G' at 200 °C prior to irradiation with light.

Inventors:
FUKATANI JUICHI (JP)
UENOMACHI KIYOMI (JP)
OKABAYASHI TAKAZUMI (JP)
EBINA RYOUSUKE (JP)
WADA ATSUSHI (JP)
Application Number:
PCT/JP2016/079804
Publication Date:
April 13, 2017
Filing Date:
October 06, 2016
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L29/14; C08K5/101; C08K5/1515; B29C48/08
Foreign References:
JPS59207913A1984-11-26
JPH07319160A1995-12-08
JPS4997049A1974-09-13
Other References:
See also references of EP 3360925A4
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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