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Patent Searching and Data


Title:
POP (PACKAGE ON PACKAGE) STRUCTURE AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2018/126542
Kind Code:
A1
Abstract:
Disclosed are a PoP (package on package) structure and a terminal. The PoP structure comprises: a main board (10) and at least two package layers arranged in a stacked manner along the direction away from the main board, wherein the package layer, closest to one side of the main board, in the at least two package layers is in welded connection with the main board; the package layer, close to one side of the main board, in any two adjacent package layers is a lower package layer (20), and the package layer away from one side of the main board is an upper package layer (30); the lower package layer is in welded connection with the upper package layer; a first adhesive pouring layer (40) is also arranged between the lower package layer and the upper package layer; a first adhesive pouring area (21) corresponding to the first adhesive pouring layer is arranged in the lower package layer; and the first adhesive pouring area does not overlap with the upper package layer. During dispensing, a dispensing material is dripped in the first adhesive pouring area of the lower package layer, after the dispensing material fully fills the first adhesive pouring area, dispensing is stopped, and the first adhesive pouring layer is formed after the dispensing material is cured, thus solving the problem in the prior art that a space between the lower package layer and the upper package layer is difficult to fill completely or is easily filled partially.

Inventors:
SHI HONGBIN (CN)
YE RUNQING (CN)
LONG HAOHUI (CN)
Application Number:
PCT/CN2017/078636
Publication Date:
July 12, 2018
Filing Date:
March 29, 2017
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L25/00; H01L23/13; H01L23/31
Foreign References:
CN203026500U2013-06-26
CN102148166A2011-08-10
CN2524375Y2002-12-04
US6414384B12002-07-02
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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