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Patent Searching and Data


Title:
PORE FORMING METHOD AND PORE FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/185635
Kind Code:
A1
Abstract:
The present invention achieves the formation of a nanopore having a desired size (a nanopore having a size close to the size of an object to be detected) at a high yield by utilizing the dielectric breakdown phenomenon. The present disclosure proposes, as one embodiment, a pore forming method comprising: disposing a film between a first electrolyte and second electrolyte that are stored in a chamber structure; bringing a first electrode and second electrode into contact with the first electrolyte and second electrolyte, respectively; outputting a first voltage from a voltage source to a circuit configured by disposing the voltage source and resistance on the wiring connecting the first electrode and second electrode; measuring a second voltage between the first electrode and second electrode; detecting a significant change in the second voltage; and stopping output of the first voltage in response to detection of the significant change in the second voltage (see FIG. 5).

Inventors:
YANAGI ITARU (JP)
YANAGAWA YOSHIMITSU (JP)
Application Number:
PCT/JP2021/043856
Publication Date:
September 09, 2022
Filing Date:
November 30, 2021
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
B01J19/08; C12M1/00; C25F3/14; G01N27/00
Domestic Patent References:
WO2015097765A12015-07-02
Foreign References:
JP2015525114A2015-09-03
JP2018513774A2018-05-31
JP2020094894A2020-06-18
JP2008545518A2008-12-18
Other References:
JACOB K ROSENSTEIN ET AL., NATURE METHODS, vol. 9, no. 5, 2012, pages 487 - 492
HAROLD KWOK ET AL., PLOS ONE, vol. 9, no. 3, 2013, pages 92880
KYLE BRIGGS ET AL., NANOTECHNOLOGY, vol. 26, 2015
KYLE BRIGGS ET AL., SMALL, vol. 10, no. 10, 2014, pages 2077 - 86
TREVOR J. MORIN ET AL., PLOS ONE, vol. 11, no. 5, pages e0154426
ITARU YANAGI ET AL., SCIENTIFIC REPORTS, vol. 4, 2014, pages 5000
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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