Title:
POROUS COPPER BODY, AND POROUS COPPER COMPOSITE MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/199571
Kind Code:
A1
Abstract:
This porous copper body (10) is provided with a skeleton (13) having a three-dimensional network structure, and is characterized in that: an uneven porous layer (12) is formed on the surface of the skeleton (13); the specific surface area is set so as to be at least 0.01 m2/g; and the porosity is set so as to be in the range of 50-90% inclusive.
Inventors:
KITA KOICHI (JP)
KATO JUN (JP)
SAIWAI TOSHIHIKO (JP)
KATO JUN (JP)
SAIWAI TOSHIHIKO (JP)
Application Number:
PCT/JP2016/065283
Publication Date:
December 15, 2016
Filing Date:
May 24, 2016
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B22F3/11; B22F7/04; C22C1/08; C22C9/00; C22C9/02
Domestic Patent References:
| WO2016063905A1 | 2016-04-28 |
Foreign References:
| JP2000192107A | 2000-07-11 | |||
| JP2009079766A | 2009-04-16 | |||
| JP2013189676A | 2013-09-26 |
Other References:
See also references of EP 3308884A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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