Title:
POROUS PLATE-SHAPED FILLER AND THERMAL INSULATION FILM
Document Type and Number:
WIPO Patent Application WO/2015/115668
Kind Code:
A1
Abstract:
Provided are a porous plate-shaped filler that can be used as a material for a thermal insulation film having exceptional thermal insulation performance, and a thermal insulation film. The porous plate-shaped filler (1) has a plate-like shape with an aspect ratio of 3 or higher and a minimum length is 0.5-50 μm, the overall porosity of the porous plate-shaped filler being 20-90%, and the porosity being lower on the periphery than in the center. Less of a matrix penetrates the filler, whereby the thermal conductivity can be lowered. Therefore, even a thin thermal insulation film has a greater thermal insulation effect than in the past.
Inventors:
KOBAYASHI HIROHARU (JP)
Application Number:
PCT/JP2015/053022
Publication Date:
August 06, 2015
Filing Date:
January 28, 2015
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
C04B38/06; C04B38/08; C08K7/24; F02F1/00; F02F1/42
Domestic Patent References:
| WO2013191263A1 | 2013-12-27 | |||
| WO2010023957A1 | 2010-03-04 |
Foreign References:
| JP2007182491A | 2007-07-19 | |||
| JP2002160907A | 2002-06-04 |
Attorney, Agent or Firm:
WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)
Ippei Watanabe (JP)
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