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Title:
POROUS RESIN SHEET AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/133316
Kind Code:
A1
Abstract:
Provided is a porous resin sheet that is a thick film having a thickness of at least 1 mm, has a low dielectric constant and dielectric loss tangent, and has a high elastic modulus, and a method for manufacturing same. The single-layered porous resin sheet that includes a thermoplastic resin has a thickness of at least 1.0 mm, a relative permittivity of 2.00 or less at 1 GHz, a dielectric loss tangent of 0.0050 or less, and a tensile modulus of at least 200 MPa. Also, the method for manufacturing the porous resin sheet comprises a gas impregnation process in which a non-reactive gas is impregnated under increased pressure into a thermoplastic resin composition containing at least the thermoplastic resin, and a foaming process in which the thermoplastic resin composition is foamed by decreasing the pressure after the gas impregnation process. The porous resin sheet is employed as a patch antenna used particularly in a mobile phone antenna.

Inventors:
IKENAGA HIROKO (JP)
KASAGI TOMOYUKI (JP)
SUTOU TAKESHI (JP)
UKEI HIROICHI (JP)
Application Number:
PCT/JP2013/056117
Publication Date:
September 12, 2013
Filing Date:
March 06, 2013
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08J9/12; B32B15/088; H05K1/03
Foreign References:
JP2001055464A2001-02-27
JP2006111708A2006-04-27
JP2008238483A2008-10-09
JP2000269616A2000-09-29
JP2004087638A2004-03-18
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
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