Title:
POSITION-ALIGNING METHOD AND POSITION-ALIGNING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198801
Kind Code:
A1
Abstract:
This position-aligning method for aligning the positions of two stacked substrates includes a step of measuring the position of a mark selected from a plurality of marks disposed on at least one of the two substrates, and a step of aligning the positions of the two substrates on the basis of the position of the measured mark, wherein the measured mark is selected on the basis of information pertaining to strain in at least one of the substrates. The mark may be a mark disposed in a region in which the amount of strain of at least one of the substrates is smaller than a threshold value. The mark may be a mark disposed in a region in which the reproducibility of strain caused in at least one of the substrates is greater than a threshold value.
Inventors:
MITSUISHI HAJIME (JP)
FUKUDA MINORU (JP)
SUGAYA ISAO (JP)
FUKUDA MINORU (JP)
SUGAYA ISAO (JP)
Application Number:
PCT/JP2019/015865
Publication Date:
October 17, 2019
Filing Date:
April 11, 2019
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
H01L21/02; H01L21/68
Foreign References:
| JP2011159821A | 2011-08-18 | |||
| JP2011216833A | 2011-10-27 | |||
| JP2014116519A | 2014-06-26 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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