Title:
POSITIONAL PRECISION INSPECTION METHOD, POSITIONAL PRECISION INSPECTION DEVICE, AND POSITION INSPECTION UNIT
Document Type and Number:
WIPO Patent Application WO/2016/052012
Kind Code:
A1
Abstract:
The objective is to inspect the contact position in a simple manner and with high precision when a contact-type inspection is performed on an inspection chip on a substrate to be inspected. When an inspection of a semiconductor device formed on a wafer (W) mounted on a stage (11) is performed by means of a prober, the contact position of the probe needles with respect to electrode pads (71-75) of the semiconductor device is inspected in advance. A reticle (31), on which figures (61-65) are arranged indicating the positions of the probe needles, is arranged in place of the probe needles at the positions where the probe needles are arranged, the semiconductor device formed on the wafer (W) is imaged through the reticle (31) by means of an imaging element (33), and the positional relationship between the figures formed on the reticle (31) and the electrode pads (71-75) is analyzed from the captured image. When necessary, the position of the stage (11) is corrected so as to align the centers of the figures (61-65) and the centers of the electrode pads (71-75).
Inventors:
SAIKI KENTA (JP)
TANAKA TOSHIHIKO (JP)
TAMURA MUNEAKI (JP)
KOSHIMIZU KAZUHIKO (US)
AKAIKE SHINJI (JP)
TANAKA TOSHIHIKO (JP)
TAMURA MUNEAKI (JP)
KOSHIMIZU KAZUHIKO (US)
AKAIKE SHINJI (JP)
Application Number:
PCT/JP2015/073923
Publication Date:
April 07, 2016
Filing Date:
August 19, 2015
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G01B11/00; H01L21/66; G01R31/28
Foreign References:
| JP2001156127A | 2001-06-08 | |||
| JP2001264392A | 2001-09-26 |
Attorney, Agent or Firm:
BECCHAKU, Shigehisa et al. (JP)
Role of another Shigehisa (JP)
Role of another Shigehisa (JP)
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