Title:
POSITIVE PHOTORESIST COMPOSITION, VIA HOLE FORMATION METHOD, DISPLAY SUBSTRATE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/024547
Kind Code:
A1
Abstract:
The present invention provides a positive photoresist composition, comprising a main photoresist material and a photosensitizer. The photoresist composition further comprises a photo-induced heterogeneous compound; under ultraviolet irradiation, the structure of the photo-induced heterogeneous compound is changed to an ion structure with an improved molecular polarity degree. The formation of the ion structure with an improved molecular polarity degree reduces the adhesive force between the positive photoresist and an organic film; this is good for lift-off after a via hole is formed, and the production yield of a product is improved. Furthermore, the present invention further provides a via hole formation method using the positive photoresist composition, a display substrate comprising via holes formed by the via hole formation method, and a display device comprising the display substrate.
Inventors:
LI WEI (CN)
SU TONGSHANG (CN)
LI GUANGYAO (CN)
HU YINGBIN (CN)
MA RUI (CN)
SHAO JIFENG (CN)
ZHANG YANG (CN)
ZHANG JIANYE (CN)
SU TONGSHANG (CN)
LI GUANGYAO (CN)
HU YINGBIN (CN)
MA RUI (CN)
SHAO JIFENG (CN)
ZHANG YANG (CN)
ZHANG JIANYE (CN)
Application Number:
PCT/CN2018/084484
Publication Date:
February 07, 2019
Filing Date:
April 25, 2018
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
G02F1/1362; G03F7/039; G03F7/004
Foreign References:
| CN107422605A | 2017-12-01 | |||
| CN104093700A | 2014-10-08 | |||
| US20080311490A1 | 2008-12-18 | |||
| CN202837747U | 2013-03-27 | |||
| CN1491442A | 2004-04-21 | |||
| CN103458618A | 2013-12-18 | |||
| CN105283527A | 2016-01-27 |
Attorney, Agent or Firm:
ZHONGZI LAW OFFICE (CN)
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