POSITIVE PHOTOSENSITIVE RESIN COMPOSITE, CURING FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT US

WIPO Patent Application WO/2010/134207

A1

A positive photosensitive resin composite characterized by comprising a polybenzoxazole precursor resin (A), a photosensitive diazoquinone compound (B), the hindered phenol antioxidant (C) represented by general formula (1), and the phenol compound (D) represented by general formula (2). General formula (1): (In formula (1), R1 is a hydrogen atom, or an organic group having 1 to 4 carbon atoms. The variable a represents an integer from 1 to 3, and the variable b represents an integer from 1 to 3.) General formula (2): (In formula (2), R2 is methylene or a single bond. The variable c represents an integer from 1 to 3, and the variable d represents an integer from 1 to 3.) Provided are a positive photosensitive resin composite, a protective film, an interlayer insulating film, and a semiconductor device and display element using the same, wherein sensitivity and resolution are high, film color after curing is light, there is little discoloration even in post-curing heat treatment, and the curing film adheres strongly to the substrate.

HIRANO TAKASHI (JP)
BANBA TOSHIO (JP)
OKAMYO SHUSAKU (JP)
MAKABE HIROAKI (JP)

PCT/JP2009/059639

November 25, 2010

May 20, 2009

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SUMITOMO BAKELITE CO (JP)
HIRANO TAKASHI (JP)
BANBA TOSHIO (JP)
OKAMYO SHUSAKU (JP)
MAKABE HIROAKI (JP)

G03F7/004; G03F7/023

JP2001100416A	2001-04-13
JP2002201230A	2002-07-19
JP2007078812A	2007-03-29
JP2002229206A	2002-08-14
JP2009075182A	2009-04-09

AKATSUKA, Kenji et al. (JP)
Kenji Akatsuka (JP)

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