Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYMER HAVING RING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2007/145249
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a positive photosensitive resin composition which has high sensitivity and is reduced in film thickness reduction in unexposed areas and which, after film formation, retains a high transmission and a film thickness even through high-temperature burning or treatment with a liquid resist stripper and does not crack during ITO sputtering; and a cured film suitable for use as a film material for various displays. [MEANS FOR SOLVING PROBLEMS] The positive photosensitive resin composition comprises: ingredient (A) which is an alkali-soluble acrylic polymer having at least one of carboxy and phenolic hydroxy and at least one of hydroxy other than phenolic hydroxy and amino having active hydrogen and having a number-average molecular weight of 2,000-30,000; ingredient (B) which is an alkali-soluble resin having a ring structure in the backbone; ingredient (C) which is a compound having a vinyl ether group; ingredient (D) which is a compound having a blocked isocyanate group; ingredient (E) which is a photo-acid generator; and a solvent (F). The cured film is obtained from the composition.
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Inventors:
HATANAKA TADASHI (JP)
KOBAYASHI JUNPEI (JP)
KOBAYASHI JUNPEI (JP)
Application Number:
PCT/JP2007/061903
Publication Date:
December 21, 2007
Filing Date:
June 13, 2007
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
HATANAKA TADASHI (JP)
KOBAYASHI JUNPEI (JP)
HATANAKA TADASHI (JP)
KOBAYASHI JUNPEI (JP)
International Classes:
G03F7/039; G03F7/004; H01L21/027
Foreign References:
| JP2001027804A | 2001-01-30 | |||
| JP2005115249A | 2005-04-28 | |||
| JP2004212678A | 2004-07-29 | |||
| JP2004536328A | 2004-12-02 |
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (Shin-Ochanomizu Urban Trinity2, Kandasurugadai 3-chom, Chiyoda-ku Tokyo 62, JP)
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