Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION
Document Type and Number:
WIPO Patent Application WO/2022/255171
Kind Code:
A1
Abstract:
Provided is a highly sensitive chemical amplification photosensitive resin composition containing a metal complex dye. This positive photosensitive resin composition contains: (A) a first resin having multiple alkali-soluble functional groups in which at least a portion of the multiple alkali-soluble functional groups is protected by acid-decomposable groups, (B) a photoacid generator, and (C) a metal complex dye, wherein the metal complex dye (C) contains 50 to 94 mass% metal complex ions.
Inventors:
MIYAISHI YUKI (JP)
Application Number:
PCT/JP2022/021293
Publication Date:
December 08, 2022
Filing Date:
May 24, 2022
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/004; G03F7/039; H01L27/32; H01L51/50; H05B33/12; H05B33/22
Domestic Patent References:
| WO2020246517A1 | 2020-12-10 |
Foreign References:
| JPS58122533A | 1983-07-21 | |||
| JPH07219228A | 1995-08-18 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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