Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/121895
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a positive photosensitive resin composition that at the time of development by an alkali developer, is free from development residual at pattern bottom portion (residual at pattern edge portion) and at unexposed area, film reduction and swelling, and that is capable of providing a coating excelling in contrast and pattern adherence, and that after firing thereof, realizes a cured film exhibiting high dimensional stability of pattern and low water absorptivity and excelling in thermostability and chemical resistance. [MEANS FOR SOLVING PROBLEMS] There is provided a positive photosensitive resin composition comprising polyamide acid (A) obtained by reacting a component selected from among tetracarboxylic acids and derivatives thereof with a diamine component, polyphenol compound (B) and compound (C) generating an acid upon exposure to light.
Inventors:
KATO MASAKAZU (JP)
OHISHI HISANORI (JP)
OHISHI HISANORI (JP)
Application Number:
PCT/JP2005/010406
Publication Date:
December 22, 2005
Filing Date:
June 07, 2005
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
KATO MASAKAZU (JP)
OHISHI HISANORI (JP)
KATO MASAKAZU (JP)
OHISHI HISANORI (JP)
International Classes:
G03F7/022; G03F7/023; G03F7/039; H01L21/027; G03F7/004; (IPC1-7): G03F7/004; G03F7/022; G03F7/023; G03F7/039; H01L21/027
Foreign References:
| JPH07248626A | 1995-09-26 | |||
| JP2004157461A | 2004-06-03 | |||
| JP2001064507A | 2001-03-13 | |||
| JP2001042527A | 2001-02-16 |
Attorney, Agent or Firm:
Hanabusa, Tsuneo c/o Hanabusa, Patent Office (Shin-Ochanomizu Urban Trinity 2,
Kandasurugadai 3-chom, Chiyoda-ku Tokyo 62, JP)
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