Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/020573
Kind Code:
A1
Abstract:
A positive photosensitive resin composition excellent in sensitivity and resolution, characterized by comprising 100 parts by mass of (A) a hydroxypolyamide comprising repeating units represented by the general formula (1), 1 to 50 parts by mass of (B) a photoacid generator, 5 to 20 parts by mass of (C) a carboxylic acid compound having 6 to 18 carbon atoms as represented by the general formula (2), and 0.01 to 70 parts by mass of (D) an alcohol having 4 to 14 carbon atoms as represented by the general formula (3).
Inventors:
SHIBUI SATOSHI (JP)
Application Number:
PCT/JP2007/065729
Publication Date:
February 21, 2008
Filing Date:
August 10, 2007
Export Citation:
Assignee:
ASAHI KASEI EMD CORP (JP)
SHIBUI SATOSHI (JP)
SHIBUI SATOSHI (JP)
International Classes:
G03F7/023; G03F7/004; H01L21/027
Foreign References:
| JP2006178437A | 2006-07-06 | |||
| JP2005250160A | 2005-09-15 | |||
| JP2005157327A | 2005-06-16 | |||
| JP2003345021A | 2003-12-03 | |||
| JP2001343747A | 2001-12-14 | |||
| JPH09138505A | 1997-05-27 | |||
| JP2003149816A | 2003-05-21 | |||
| JP2004029712A | 2004-01-29 | |||
| JPH0146862B2 | 1989-10-11 | |||
| JPS6396162A | 1988-04-27 | |||
| JP2000338664A | 2000-12-08 | |||
| JP2003345019A | 2003-12-03 | |||
| US2772972A | 1956-12-04 | |||
| US2797213A | 1957-06-25 | |||
| US3669658A | 1972-06-13 |
Other References:
See also references of EP 2056163A4
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