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Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/045434
Kind Code:
A1
Abstract:
A positive photosensitive resin composition which comprises (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in one molecule, and (c) a photo-acid generator, wherein the content of the compound (b) is 5 to 50 parts by weight relative to 100 parts by weight of the alkali-soluble polyimide (a). This positive photosensitive resin composition can yield, thorough low-temperature heat treatment at 200ºC or lower, a high-resolution cured film which exhibits little warpage and which does not suffer from filling of a space between lines of a pattern, said filling being associated with reflow.

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Inventors:
MASUDA YUKI
KAMEMOTO SATOSHI
ONISHI HIROYUKI
TOMIKAWA MASAO
Application Number:
PCT/JP2012/074367
Publication Date:
March 27, 2014
Filing Date:
September 24, 2012
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
MASUDA YUKI
KAMEMOTO SATOSHI
ONISHI HIROYUKI
TOMIKAWA MASAO
International Classes:
G03F7/004; G03F7/023
Domestic Patent References:
WO2010047271A12010-04-29
Foreign References:
JP2010209265A2010-09-24
JP2010085673A2010-04-15
JP2012181488A2012-09-20
JP2009221453A2009-10-01
JP2011017898A2011-01-27
JP2011116968A2011-06-16
JP2006313237A2006-11-16
JP2008224984A2008-09-25
JP2007078781A2007-03-29
JP2009258471A2009-11-05
JP2011017198A2011-01-27
Other References:
See also references of EP 2902846A4
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