POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

WIPO Patent Application WO/2016/010124

A1

Provided is a positive photosensitive resin composition, a film of which after heating and firing generates less outgas. A positive photosensitive resin composition which contains a polyalkenyl phenol resin having a structure represented by formula (1), an alkali-soluble resin (excluding a polyalkenyl phenol resin having a structure represented by formula (1)), and a quinonediazide compound. (In formula (1), each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group having 1-5 carbon atoms, an alkenyl group represented by formula (2), an alkoxy group having 1-2 carbon atoms or a hydroxyl group, and at least one of the R1, R2 and R3 moieties represents an alkenyl group represented by formula (2); and each Q independently represents an alkylene group represented by formula -CR4R5-, a cycloalkylene group having 5-10 carbon atoms, a divalent organic group having an aromatic ring, a divalent organic group having an alicyclic fused ring or a divalent group obtained by combining the preceding groups.)

JP5163812	Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor devices and display devices using the same.
WO/2004/081664	NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
JP5336049	Negative electrode base material for lithium secondary batteries

FURUE KENTARO (JP)
ONO YUKI (JP)

PCT/JP2015/070443

January 21, 2016

July 16, 2015

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SHOWA DENKO KK (JP)

G03F7/023; C08G8/30; G03F7/40; H01L51/50; H05B33/10; H05B33/22

JP2006133585A	2006-05-25
JPS62260145A	1987-11-12
JPS62260147A	1987-11-12
JPH05232696A	1993-09-10
JPH05134411A	1993-05-28
JP2013130816A	2013-07-04
JP2013015701A	2013-01-24

AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)

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