Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/007972
Kind Code:
A1
Abstract:
[Problem] To provide a novel positive photosensitive resin composition. [Solution] A positive photosensitive resin composition: containing the following component (A), component (B), component (C), and component (D), or the following component (A'), component (B), component (C), component (D), and component (E); and further containing a solvent. Component (A): an alkali-soluble resin having an acid-crosslinkable group.
Component (A'): an alkali-soluble resin that does not have an acid-crosslinkable group.
Component (B): a quinone diazide compound.
Component (C): a photoacid generator.
Component (D): a PED stability improver.
Component (E): a compound having at least two acid-crosslinkable groups in the molecule.
Inventors:
IMAI SHOTA (JP)
ADACHI ISAO (JP)
ADACHI ISAO (JP)
Application Number:
PCT/JP2022/023848
Publication Date:
February 02, 2023
Filing Date:
June 14, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08F222/20; G03F7/004; G03F7/023; G03F7/20
Foreign References:
| JP2018097084A | 2018-06-21 | |||
| JP2011138116A | 2011-07-14 | |||
| JP2007065488A | 2007-03-15 | |||
| JP2014186309A | 2014-10-02 |
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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