POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD

WIPO Patent Application WO/2008/066011

A1

Disclosed is a positive radiation-sensitive resin composition which is excellent in nano edge roughness, etching resistance, sensitivity and resolution, and enables to stably form a high-precision fine pattern. Specifically disclosed is a positive radiation-sensitive resin composition containing a radiation-sensitive acid generator (A) and an acid-cleavable group-containing resin (B). The radiation-sensitive acid generator (A) is a mixed acid generator containing an acid generator (A1) and another acid generator (A2), and the acid generator (A1) and the acid generator (A2) have a same cation. The acid generator (A1) is represented by the formula (1) below and generates a carboxylic acid having a boiling point at atmospheric pressure of not less than 150˚C when irradiated with radiation. The acid generator (A2) is represented by the formula (2) below and generates an acid other than carboxylic acids when irradiated with radiation. The resin (B) contains the repeating unit (i) below, the repeating unit (ii) below and the repeating unit (iii) below. M+RCOO- (1) M+X- (2) In the above formulae, M+ represents a monovalent onium cation; R represents a monovalent organic group; and X- represents a monovalent anion.

SHIMIZU DAISUKE
MATSUMURA NOBUJI
KAI TOSHIYUKI

PCT/JP2007/072794

June 05, 2008

November 27, 2007

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JSR CORP (JP)
SHIMIZU DAISUKE
MATSUMURA NOBUJI
KAI TOSHIYUKI

G03F7/039; G03F7/004; H01L21/027

JP2003043679A	2003-02-13
JPH11125907A	1999-05-11
JP2001281849A	2001-10-10
JP2001318464A	2001-11-16
JP2005258124A	2005-09-22
JP2007114431A	2007-05-10

WAKI, Misao (Toin-cho Inabe-gu, Mie 33, JP)

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