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Title:
POSITIVE RESIST COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2007/148623
Kind Code:
A1
Abstract:
A positive resist composition comprising a resin component (A) whose alkali solubility can be increased by the action of an acid, wherein the resin component (A) comprises a resin (A1) which has a constitutional unit (a0) represented by the general formula (a0-1) and a constitutional unit (a1) derived from an acrylate ester having an acid-dissociating dissociation inhibitory group, in which a constituent unit or units other than the constituent unit (a0) is derived from an acrylate ester.

Inventors:
IWAI TAKESHI (JP)
IRIE MAKIKO (JP)
NAKAYAMA KAZUHIKO (JP)
YAMATO HITOSHI (JP)
ASAKURA TOSHIKAGE (JP)
NISHIMAE YUICHI (JP)
Application Number:
PCT/JP2007/062112
Publication Date:
December 27, 2007
Filing Date:
June 15, 2007
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
IWAI TAKESHI (JP)
IRIE MAKIKO (JP)
NAKAYAMA KAZUHIKO (JP)
YAMATO HITOSHI (JP)
ASAKURA TOSHIKAGE (JP)
NISHIMAE YUICHI (JP)
International Classes:
G03F7/039; G03F7/004; G03F7/38; H01L21/027
Domestic Patent References:
WO2006013687A12006-02-09
Foreign References:
JP2006011374A2006-01-12
JP2006011373A2006-01-12
JP2006011250A2006-01-12
JPH11258803A1999-09-24
JPH01163736A1989-06-28
JPS61251652A1986-11-08
Attorney, Agent or Firm:
TANAI, Sumio et al. (Yaesu Chuo-ku Tokyo, 53, JP)
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