POSITIVE-TONE PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2016/147490

A1

Provided are a positive-tone photosensitive resin composition of exceptional resolution, a dry film having a resin layer obtained from the composition, a cured product of the composition or of the resin layer of the dry film, and a printed circuit board having the cured product. This positive-tone photosensitive resin composition is characterized by containing (A) an acid anhydride having a cyclic aliphatic backbone and an aromatic backbone, and a polyamic acid obtained from a diamine, and (B) a photo-acid generating agent. The polyamic acid (A) is preferably a compound having a structure represented by general formula (I) (where R1 is a tetravalent organic group including a condensed ring of an aromatic ring and an aliphatic hydrocarbon ring, or a tetravalent organic group including an aromatic group and an alicyclic hydrocarbon group, R2 is a divalent organic group, X is a divalent organic group, m is an integer of 1 or greater, and n is 0 or an integer of 1 or greater.)

JP2008191367	RADIATION-SENSITIVE RESIN COMPOSITION
JP4878662	Photosensitive resin composition
JP2006227063	POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN, AND ELECTRONIC COMPONENT

AKIMOTO MAHO (JP)
MIWA TAKAO (JP)

PCT/JP2015/083465

September 22, 2016

November 27, 2015

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TAIYO HOLDINGS CO LTD (JP)

G03F7/023; G03F7/004; G03F7/039; H05K3/28; C08G73/10

WO2010071100A1

2010-06-24

JP2003076007A	2003-03-14
JP2007314614A	2007-12-06
JP2007314583A	2007-12-06
JP2004272083A	2004-09-30
JP2011133699A	2011-07-07
JP2010196041A	2010-09-09
JP2003043686A	2003-02-13
KR20120111072A	2012-10-10
JP2007086763A	2007-04-05
JP2011227133A	2011-11-10

HONDA ICHIRO (JP)
Ichiro Honda (JP)

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