Title:
POSITIVE-TYPE PHOTOSENSITIVE ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE AGENT LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/170432
Kind Code:
A1
Abstract:
The present invention relates to a positive-type photosensitive adhesive composition comprising (A) an alkali-soluble resin, (B) a compound that generates an acid when exposed to light, (c) a thermo-crosslinking agent, and (D) a curing promoter.
Inventors:
YORI HANAKO (JP)
Application Number:
PCT/JP2014/084560
Publication Date:
November 12, 2015
Filing Date:
December 26, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J11/06; G03F7/004; G03F7/023; H01L21/52; H01L21/60; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2010047271A1 | 2010-04-29 | |||
| WO2012005079A1 | 2012-01-12 |
Foreign References:
| JP2005181976A | 2005-07-07 | |||
| JP2006323128A | 2006-11-30 | |||
| JP2009141010A | 2009-06-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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