Title:
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM
Document Type and Number:
WIPO Patent Application WO/2010/010842
Kind Code:
A1
Abstract:
Disclosed are: a positive-type photosensitive resin composition which has high sensitivity and can exhibit excellent heat resistance and reliability even when the composition is cured at a lower temperature; a cured film which has high sensitivity and can exhibit excellent heat resistance and reliability even when the film is cured at a lower temperature; a protective film; an insulating film; and a semiconductor device and a display device, each of which comprises the cured film.
The positive-type photosensitive resin composition is characterized by comprising a polyamide resin and a photosensitizing agent, wherein the polyamide resin has a specific structure. The cured film is characterized by comprising the positive-type photosensitive resin composition. Each of the protective film and the insulating film is characterized by comprising the cured film. Each of the semiconductor device and the display device is characterized by comprising the cured film.
Inventors:
TERAYAMA MIKI (JP)
Application Number:
PCT/JP2009/062894
Publication Date:
January 28, 2010
Filing Date:
July 16, 2009
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
TERAYAMA MIKI (JP)
TERAYAMA MIKI (JP)
International Classes:
G03F7/023; C08G73/22; G03F7/022
Domestic Patent References:
| WO2008050886A1 | 2008-05-02 |
Foreign References:
| JPS6460630A | 1989-03-07 | |||
| JP2008156614A | 2008-07-10 | |||
| JP2004125814A | 2004-04-22 | |||
| JP2008170498A | 2008-07-24 |
Other References:
See also references of EP 2309329A4
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
Kishimoto Expert (JP)
Kishimoto Expert (JP)
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