Title:
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF, AND SOLID-STATE IMAGING ELEMENT HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2019/189387
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a positive-type photosensitive resin composition that exhibits high optical transparency, is highly resistant to heat, and has superior patterning properties. The present invention pertains to a positive-type photosensitive resin composition comprising polysiloxane (A), a naphthoquinone diazide compound (B), and a solvent (C), wherein the polysiloxane (A) contains at least one type of structure selected from among general formulas (1)-(3) and at least one type of structure selected from among general formulas (4)-(6). (In general formulas (1)-(3), R4 is a hydrocarbon group containing an unsaturated double bond having 2-6 carbon atoms, and R1 is a single bond or an alkylene group having 1-4 carbon atoms. R2 in formula (2) represents hydrogen or an alkyl group having 1-4 carbon atoms. In general formula (3), R3 represents an organic group.) (In general formula (5), R2 represents hydrogen or an alkyl group having 1-4 carbon atoms. In general formula (6), R3 represents an organic group.)
Inventors:
MATOBA YOSHINORI (JP)
HIBINO TOSHIYASU (JP)
SUWA MITSUHITO (JP)
HIBINO TOSHIYASU (JP)
SUWA MITSUHITO (JP)
Application Number:
PCT/JP2019/013238
Publication Date:
October 03, 2019
Filing Date:
March 27, 2019
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/075; C08F299/08; C08G77/20; G03F7/004; G03F7/023; G03F7/20; G03F7/38; G03F7/40
Domestic Patent References:
| WO2010061744A1 | 2010-06-03 | |||
| WO2015111607A1 | 2015-07-30 |
Foreign References:
| JP2017097378A | 2017-06-01 | |||
| JP2014237771A | 2014-12-18 | |||
| JP5822048B2 | 2015-11-24 | |||
| JP2013018850A | 2013-01-31 | |||
| JP2013147659A | 2013-08-01 |
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