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Patent Searching and Data


Title:
POWDER FOR CONDUCTIVE MATERIAL, INK FOR CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, AND METHOD OF PREPARING POWDER FOR CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/057341
Kind Code:
A1
Abstract:
A powder for conductive material according to an embodiment of the present invention is composed of a large number of particles containing copper as a main component and has an average primary particle diameter of 1-200 nm, wherein the particles contain titanium on the surface or inside thereof, and the content of titanium is 0.003-0.5 atomic%.

Inventors:
OKADA ISSEI (JP)
SUGIURA MOTOHIKO (JP)
OKA YOSHIO (JP)
OHKI KENJI (JP)
Application Number:
PCT/JP2016/078409
Publication Date:
April 06, 2017
Filing Date:
September 27, 2016
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
B22F1/054; B22F9/24; C22C9/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Foreign References:
JP2015036442A2015-02-23
JP2012172170A2012-09-10
JP2004311265A2004-11-04
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
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