Title:
POWDER FOR ELECTROCONDUCTIVE FILLER
Document Type and Number:
WIPO Patent Application WO/2015/190373
Kind Code:
A1
Abstract:
Provided is a powder for an electroconductive filler containing 1-30% by mass inclusive of Ag, and 1-30% by mass inlcusive of Bi, the remainder comprising Cu and a Cu-Ag-Bi alloy, which is an inevitable impurity. This powder for a conductive filler has exceptional electroconductivity and can be attained at low cost.
Inventors:
KUSE TETSUJI (JP)
KARIYA TETSURO (JP)
KARIYA TETSURO (JP)
Application Number:
PCT/JP2015/066117
Publication Date:
December 17, 2015
Filing Date:
June 03, 2015
Export Citation:
Assignee:
SANYO SPECIAL STEEL CO LTD (JP)
International Classes:
C22C9/00; B22F1/00; C22C9/02; C22C9/04; C22C9/08; H01B1/02; H01B5/00
Foreign References:
| JP2010196105A | 2010-09-09 | |||
| JP2010123681A | 2010-06-03 | |||
| JP2012250240A | 2012-12-20 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Masaharu Takamura (JP)
Masaharu Takamura (JP)
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