Title:
POWDER FILM FORMING METHOD AND POWDER FILM FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/143459
Kind Code:
A1
Abstract:
This powder film forming method comprises: a filling step for filling an opening (3) formed in a screen plate (2) with powder (9); and a film forming step for forming a powder film (11) by generating a potential difference between the screen plate (2) and a substrate (10) and by moving, to the substrate (10), the powder (9) with which the opening (3) is filled.
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Inventors:
NISHIURA SOUSUKE (JP)
SUGIYO TAKESHI (JP)
FUKUI HIDEYUKI (JP)
SUGIYO TAKESHI (JP)
FUKUI HIDEYUKI (JP)
Application Number:
PCT/JP2018/003840
Publication Date:
August 09, 2018
Filing Date:
February 05, 2018
Export Citation:
Assignee:
HITACHI SHIPBUILDING ENG CO (JP)
International Classes:
B41M1/42; B05C19/04; B05D1/06; B05D7/24; B41F15/08
Foreign References:
| JP2010207780A | 2010-09-24 | |||
| JP2010207779A | 2010-09-24 | |||
| JPS57107270A | 1982-07-03 | |||
| US3081698A | 1963-03-19 | |||
| JP2012179786A | 2012-09-20 | |||
| JP2012140016A | 2012-07-26 |
Other References:
See also references of EP 3578374A4
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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