Title:
POWDER FOR POWDER LAMINATION MOLDING AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2020/138188
Kind Code:
A1
Abstract:
This powder for powder lamination molding has a particle size distribution given by a D10 value of 20-42 µm, a D50 value of 42-70 µm, and a D90 value of 100 µm or smaller, and contains polybutylene terephthalate having a melting peak half-value width of 1-10°C in a DSC chart. Even when ground with a rotating blade or the like, this powder for powder lamination molding has excellent grindability such that stretching of the powder and softening of the resin can be suppressed, a powder layer having a uniform thickness and without deficiencies can be formed during molding, and the desired molded article can be manufactured with good precision.
Inventors:
SUGIHARA MASAKI (JP)
KISHISHITA MINORU (JP)
YAMANAKA YASUSHI (JP)
KISHISHITA MINORU (JP)
YAMANAKA YASUSHI (JP)
Application Number:
PCT/JP2019/050869
Publication Date:
July 02, 2020
Filing Date:
December 25, 2019
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
MITSUBISHI ENG PLASTICS CORP (JP)
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
B33Y10/00; B29C64/153; B29C64/30; B33Y70/00; B33Y80/00
Domestic Patent References:
| WO2016121013A1 | 2016-08-04 |
Foreign References:
| JP2018086757A | 2018-06-07 | |||
| JP2015025127A | 2015-02-05 | |||
| JP2018243230A | 2018-12-26 |
Other References:
See also references of EP 3904097A4
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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