Title:
POWDER-MATERIAL SUPPLY DEVICE FOR THREE-DIMENSIONAL MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/151831
Kind Code:
A1
Abstract:
Provided is a powder-material supply device which makes it possible to form a powder-material layer in which the density of the powder material therein is increased to the maximum possible, in a three-dimensional molding device for producing three-dimensional molded articles from a powder material. To this end, a flattening member for adjusting the thickness of a layer of a powder material supplied onto a table to a prescribed layer thickness while flattening the upper surface of the powder-material layer is configured so as to: adjust the thickness of the powder-material layer while downwardly pressing the powder-material layer to be flattened in concert with the movement of the powder-material supply device; and flatten the upper surface of the powder-material layer.
Inventors:
OOBA YOSHIKAZU (JP)
KATOU YOUSUKE (JP)
SUZUKI KOUKICHI (JP)
DAICHO YUYA (JP)
MIYANO HIDEAKI (JP)
OKANE TOSHIMITSU (JP)
IMAMURA SATOSHI (JP)
KAJINO SATOSHI (JP)
KATOU YOUSUKE (JP)
SUZUKI KOUKICHI (JP)
DAICHO YUYA (JP)
MIYANO HIDEAKI (JP)
OKANE TOSHIMITSU (JP)
IMAMURA SATOSHI (JP)
KAJINO SATOSHI (JP)
Application Number:
PCT/JP2015/058240
Publication Date:
October 08, 2015
Filing Date:
March 19, 2015
Export Citation:
Assignee:
CMET INC (JP)
NAT INST OF ADVANCED IND SCIEN (JP)
NAT INST OF ADVANCED IND SCIEN (JP)
International Classes:
B29C67/00; B22F3/105; B28B1/30; B28B13/02; B33Y30/00
Foreign References:
| JP2006205456A | 2006-08-10 | |||
| JPH11245308A | 1999-09-14 | |||
| JP2013507275A | 2013-03-04 | |||
| JP2005144870A | 2005-06-09 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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