Title:
POWDER MATERIAL FOR USE IN POWDER LAMINATE MOLDING, POWDER LAMINATE MOLDING METHOD USING SAME, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/100756
Kind Code:
A1
Abstract:
Provided is a powder material that is for producing a fine molded article that has improved hardness by means of a powder laminate molding method. A powder material that includes ceramic and metal and is to be used for powder laminate molding, the tapped fill rate of the powder material, defined as (tapped density/theoretical density)×100%, being at least 40%.
Inventors:
YAMADA JUNYA (JP)
IBE HIROYUKI (JP)
KATO NOBUAKI (JP)
KATO YUTA (JP)
SUGIYAMA YOSHIKAZU (JP)
IBE HIROYUKI (JP)
KATO NOBUAKI (JP)
KATO YUTA (JP)
SUGIYAMA YOSHIKAZU (JP)
Application Number:
PCT/JP2019/043950
Publication Date:
May 22, 2020
Filing Date:
November 08, 2019
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
B22F1/05; B22F1/052; B22F3/105; B22F3/16; B33Y10/00; B33Y30/00; B33Y70/00; B33Y80/00; C22C1/05; B22F1/10; B22F1/148; C22C29/08
Domestic Patent References:
| WO2017178319A1 | 2017-10-19 | |||
| WO2015194678A1 | 2015-12-23 |
Foreign References:
| JP2017519101A | 2017-07-13 | |||
| JP2003245981A | 2003-09-02 | |||
| JPH06218712A | 1994-08-09 | |||
| JP2017113952A | 2017-06-29 | |||
| JP2017114716A | 2017-06-29 |
Other References:
See also references of EP 3881953A4
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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