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Patent Searching and Data


Title:
POWDER METALLURGY BINDER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/091046
Kind Code:
A1
Abstract:
The present invention relates to a powder metallurgy binder composition capable of removing (that is, debinding) a binder at a low temperature within a short time and capable of preventing the generation of sintered body defects by the crystallization of a specific component within the binder composition. According to the present invention, the powder metallurgy binder composition comprises 10-50 vol% of a path formation component, 10-70 vol% of a wax component, 0-30 vol% of a resin component and 1-30 vol% of a surfactant component, wherein the path formation component comprises benzoic acid and one or more types of aromatic materials.

Inventors:
LEE WON-SIK (KR)
CHOI HAN-SHIN (KR)
JANG JIN-MAN (KR)
Application Number:
PCT/KR2016/013765
Publication Date:
June 01, 2017
Filing Date:
November 28, 2016
Export Citation:
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Assignee:
KOREA IND TECH INST (KR)
International Classes:
C08L91/06; B22F1/00; C08K5/105; C08L101/00
Foreign References:
CN103642253A2014-03-19
KR20070018026A2007-02-13
US20090129961A12009-05-21
KR20030020608A2003-03-10
KR20150125874A2015-11-10
Attorney, Agent or Firm:
IAM PATENT FIRM (KR)
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