Title:
POWER AMPLIFICATION CIRCUIT FOR SUB-ARRAY BEAM FORMING SYSTEM, AND SUB-ARRAY BEAM FORMING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/103779
Kind Code:
A1
Abstract:
Provided are a power amplification circuit for a sub-array beam forming system, and a sub-array beam forming system. The sub-array beam forming system of the present application comprises multiple transmission channels, wherein each transmission channel comprises a signal pre-processing module, a first digital-to-analog converter, a radio frequency link and a sub-array module connected in sequence, and the sub-array module comprises at least one antenna array module. The power amplification circuit comprises multiple power amplification sub-circuits, wherein each power amplification sub-circuit comprises an envelope signal generation circuit, a power supply modulation module and a power amplification unit connected in sequence, and the power amplification unit comprises at least one power amplifier. The multiple power amplification sub-circuits correspond to the multiple transmission channels on a one-to-one basis. For each transmission channel, an input end of the envelope signal generation circuit in the corresponding power amplification sub-circuit is connected to a connection point in the transmission channel, and the at least one power amplifier in the corresponding power amplification sub-circuit is respectively arranged at an input end of each antenna array module in the transmission channel. The present application improves the power amplification efficiency of the sub-array beam forming system.
More Like This:
| JP4014072 | Power amplifier module |
| WO/2002/097972 | POWER AMPLIFIER CONTROL |
| JP4752509 | amplifier |
Inventors:
CHENG QIANFU (CN)
CAI HUA (CN)
WANG GUANGJIAN (CN)
HUANG JINGJING (CN)
LIANG DONG (CN)
CAI HUA (CN)
WANG GUANGJIAN (CN)
HUANG JINGJING (CN)
LIANG DONG (CN)
Application Number:
PCT/CN2019/119109
Publication Date:
May 28, 2020
Filing Date:
November 18, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H03F1/02; H04B7/06
Domestic Patent References:
| WO2015168403A1 | 2015-11-05 | |||
| WO2017107063A1 | 2017-06-29 | |||
| WO2017193199A1 | 2017-11-16 |
Foreign References:
| CN103907283A | 2014-07-02 | |||
| CN101247153A | 2008-08-20 | |||
| CN103166666A | 2013-06-19 | |||
| CN107241114A | 2017-10-10 | |||
| CN201811408462A | 2018-11-23 |
Other References:
See also references of EP 3869704A4
Download PDF:
Previous Patent: APPLICATION OF CHIDAMIDE
Next Patent: METHOD AND APPARATUS FOR TRANSMITTING HYBRID AUTOMATIC REPEAT REQUEST ACKNOWLEDGEMENT (HARQ-ACK)
Next Patent: METHOD AND APPARATUS FOR TRANSMITTING HYBRID AUTOMATIC REPEAT REQUEST ACKNOWLEDGEMENT (HARQ-ACK)