Title:
POWER AMPLIFICATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/008545
Kind Code:
A1
Abstract:
Provided is a power amplification structure. The power amplification structure comprises a substrate (10) and a printed circuit board (20) disposed on the substrate (10). The side of the substrate (10) facing the printed circuit board (20) is provided with a main solder drainage channel (11). The power amplification structure addresses the problem of a poor contact between a separation wall and a cover in a power amplification structure in the prior art.
Inventors:
ZHANG HUA (CN)
WAN TENG (CN)
BIAN FENGGUO (CN)
WANG XIAOPING (CN)
GUO YAOBIN (CN)
WAN TENG (CN)
BIAN FENGGUO (CN)
WANG XIAOPING (CN)
GUO YAOBIN (CN)
Application Number:
PCT/CN2016/079089
Publication Date:
January 19, 2017
Filing Date:
April 12, 2016
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K1/02; H05K1/11
Foreign References:
| CN101170872A | 2008-04-30 | |||
| CN204335161U | 2015-05-13 | |||
| CN104135814A | 2014-11-05 | |||
| CN102026497A | 2011-04-20 |
Attorney, Agent or Firm:
KANGXIN PARTNERS, P. C. (CN)
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