Title:
POWER CHARGING PLATFORM
Document Type and Number:
WIPO Patent Application WO/2012/081519
Kind Code:
A1
Abstract:
[Problem] To dispose and fix a position detection coil in an optimal position. [Solution] Provided is a power charging platform with: a power source coil (11) which is built inside the main case (20) and disposed on the inside surface of power charging surface (21), such that when a battery pack or a battery-driven device with a battery pack installed (50) is mounted on the power charging surface (21), the power source coil (11) is oriented facingthe side of a circular induction coil (51), which is disposed in the battery pack, in order to make possible electromagnetic coupling between the power source coil (11) and the induction coil (51); a movement mechanism (13) to move the power source coil (11) within the range of the power charging surface (21); a power transmission circuit for supplying electric power to the power source coil (11); a plurality of position detection coils (30) for detecting the position of the induction coil (51) and disposed flush with the power charging surface (21); a printed circuit board (37) wired with the position detection coils (30), and disposed inside the main case (20) between the power charging surface (21) and the movement region of the movement mechanism (13) of the power source coil (11), and kept in contact with the power charging surface (21).
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Inventors:
TOYA SHOICHI (JP)
ARAI YUJI (JP)
TERAO KYOZO (JP)
ARAI YUJI (JP)
TERAO KYOZO (JP)
Application Number:
PCT/JP2011/078557
Publication Date:
June 21, 2012
Filing Date:
December 09, 2011
Export Citation:
Assignee:
SANYO ELECTRIC CO (JP)
TOYA SHOICHI (JP)
ARAI YUJI (JP)
TERAO KYOZO (JP)
TOYA SHOICHI (JP)
ARAI YUJI (JP)
TERAO KYOZO (JP)
International Classes:
H02J17/00; H01M10/46; H02J7/00
Foreign References:
JP2010273466A | 2010-12-02 | |||
JP2010183706A | 2010-08-19 | |||
JPH10164197A | 1998-06-19 | |||
JP2000277201A | 2000-10-06 |
Attorney, Agent or Firm:
OHASHI MASAAKI (JP)
Masaaki Ohashi (JP)
Masaaki Ohashi (JP)
Download PDF:
Claims:
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