Title:
POWER CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2019/009088
Kind Code:
A1
Abstract:
This power circuit module (101) is provided with: an electronic circuit board (1); a heat generation element (2) which is mounted on a first surface (S1) of the electronic circuit board (1) and is a semiconductor electronic component constituting a portion of a power circuit; a temperature detection element (5) which detects the temperature of the heat generation element (2); an electric circuit wire (6); a heat dissipation body (3) which dissipates heat from the heat generation element (2); and a heat-conductive sheet (4) having a certain thickness and exhibiting elasticity and flexibility. The heat-conductive sheet (4) is disposed between the heat generation element (2) and the heat dissipation body (3). The temperature detection element (5) is thermally connected to the heat generation element (2) via the heat-conductive sheet (4) and electrically connected to the heat generation element (2) via the electric circuit wire. The magnitudes of the heat capacities of the temperature detection element (5), the heat generation element (2), and the heat dissipation body (3) have the following relationship: temperature detection element < heat generation element < heat dissipation body.
Inventors:
HOSOTANI TATSUYA (JP)
Application Number:
PCT/JP2018/023607
Publication Date:
January 10, 2019
Filing Date:
June 21, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/36; G01K1/14; G01K1/16; G01K7/22; H01L23/34; H01L25/07; H01L25/18; H05K7/20
Foreign References:
| JP2014107359A | 2014-06-09 | |||
| JP2011033479A | 2011-02-17 | |||
| JP2002076236A | 2002-03-15 | |||
| JPH03283458A | 1991-12-13 | |||
| JP2012505528A | 2012-03-01 | |||
| JPS516870U | 1976-01-19 | |||
| JP2002124618A | 2002-04-26 | |||
| JPH09175145A | 1997-07-08 | |||
| JP2002353385A | 2002-12-06 | |||
| JPH0927690A | 1997-01-28 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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