Title:
POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/020797
Kind Code:
A1
Abstract:
A power conversion circuit (130) includes a switching element (132) for increasing and decreasing an output current (Io) flowing to a load device (200). A current detection unit (140) outputs a first detection signal (Vdet) corresponding to the output current (Io). A second detection signal (Vdet#) is generated by extracting AC components from the first detection signal. A first hysteresis control unit (170) generates a first control signal (Sh1) in accordance with a comparison between the first detection signal (Vdet) and first threshold values (V1h, Vll). A second hysteresis control unit (190) generates a second control signal (Sh2) in accordance with a comparison between the second detection signal and second threshold values (V2h, V2l). A selection unit (197) selects either the first or the second control signal and transmits the selected signal to the switching element (132). The first threshold value changes in accordance with changes in the operational state of the load device, and the difference thereof with the second threshold value is adjusted in accordance with the switching frequency.
Inventors:
ISHIGURO YOSHIAKI (JP)
SAKASHITA TOMOKAZU (JP)
SAKASHITA TOMOKAZU (JP)
Application Number:
PCT/JP2017/019112
Publication Date:
February 01, 2018
Filing Date:
May 23, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H02M3/155; B60Q1/04; H05B37/02
Foreign References:
| JP2014216600A | 2014-11-17 | |||
| JP2013093214A | 2013-05-16 | |||
| JP2005341712A | 2005-12-08 | |||
| JP2015532085A | 2015-11-05 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF:
Previous Patent: ACTUATOR, SENSOR DEVICE, AND CONTROL DEVICE
Next Patent: DOUBLE-SIDED WAFER POLISHING METHOD
Next Patent: DOUBLE-SIDED WAFER POLISHING METHOD