Title:
POWER CONVERTER COOLING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2006/103721
Kind Code:
A1
Abstract:
A cooling structure is provided for efficiently cooling both a power semiconductor element (1) and a smoothing capacitor (2) of a power converter. A plurality of power semiconductor elements (1) are adjacently connected on one side of the smoothing capacitor (2) to constitute a group (3), a plurality of groups (3a-3c) are laterally arranged on a cooling plate (5) so that the power semiconductor elements (1) and the smoothing capacitors (2) are alternately arranged, and a cooling medium flow path (6) for communicating a cooling medium for cooling the power semiconductor (1) and the smoothing capacitor (2) is provided on the cooling plate (5) directly under the power semiconductor element (1).
Inventors:
KOBAYASHI TOMOHIRO (JP)
Application Number:
PCT/JP2005/005561
Publication Date:
October 05, 2006
Filing Date:
March 25, 2005
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
KOBAYASHI TOMOHIRO (JP)
KOBAYASHI TOMOHIRO (JP)
Foreign References:
| JPH1118429A | 1999-01-22 | |||
| JP2002093974A | 2002-03-29 | |||
| JP2000092858A | 2000-03-31 | |||
| JPS60165743A | 1985-08-28 | |||
| JPH11274001A | 1999-10-08 |
Attorney, Agent or Firm:
Oiwa, Masuo (Minamitsukaguchi-cho 2-chome Amagasaki-shi, Hyogo 12, JP)
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